Multilayer interconnects

Details Multilayer interconnects Multilayer interconnects

1989-08-01

1992-01-14

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428137, 428210, 428426, 428432, 428688, 428457, 428901, 361397, 427 96, 156 60, B32B 900

Patent

active

050809580

ABSTRACT:
A multilayer interconnect comprising a ceramic substrate, a patterned conductor layer, a layer of acrylic or acrylate adhesive, an organic insulating film, and a metal foil layer. Active electrical components can be soldered onto the metal foil layer. These circuits are particularly useful in under the hood automotive applications.

REFERENCES:
patent: 4740414 (1988-04-01), Shaheen
patent: 4804575 (1989-02-01), Kohm
patent: 4836651 (1989-06-01), Anderson
patent: 4915983 (1990-04-01), Lake et al.
patent: 4927742 (1990-05-01), Kohm

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