Multilayer interconnection system for multichip high performance

Details Multilayer interconnection system for multichip high performance Multilayer interconnection system for multichip high performance

1987-05-05

1988-09-13

Dang, Vi Duong

Fishing, trapping, and vermin destroying

427 541, 427 98, 2041921, 430310, 430313, 430314, 430329, 430315, B05D 512

Patent

active

047708972

ABSTRACT:
A method for fabricating a multilayer interconnection system that is fully planar with completely sealed and corrosion resistant conductors separated by dielectric material.

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Advance Notice of New Product, Ciba-Geigy, Microelectronic Chemicals, Aug. 13, 1985.
New Developements in Photosensitive Polyimides, E. Merck, no date.
Selectilux.RTM. HTR 3 Photosensitive Polyiimide Preliminary Data Sheet, EM Indistries, no date.

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