Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2011-03-29
2011-03-29
Patel, Ishwarbhai B (Department: 2835)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S255000
Reexamination Certificate
active
07915541
ABSTRACT:
According to an aspect of an embodiment, a multilayer interconnection substrate includes a resin substrate layer including a first insulating layer made of a resin, and a first interconnection layer made of a conductive material, a ceramic substrate layer including a second insulating layer made of a ceramic, and a second interconnection layer made of a conductive material, a mechanically bonding layer mechanically bonding the resin substrate layer and the ceramic substrate layer which are laminated, and an electrically bonding member penetrating the mechanically bonding layer and electrically bonding the resin substrate layer and the ceramic substrate layer.
REFERENCES:
patent: 5396034 (1995-03-01), Fujita et al.
patent: 5488542 (1996-01-01), Ito
patent: 5768108 (1998-06-01), Miura et al.
patent: 55-11883 (1980-01-01), None
patent: 05-082929 (1993-04-01), None
patent: 9-148743 (1997-06-01), None
patent: 10-93240 (1998-04-01), None
patent: 11-274347 (1999-10-01), None
patent: 2000-216544 (2000-08-01), None
patent: 2002-271038 (2002-09-01), None
International Search Report of PCT/JP2005/018684; date of mailing Dec. 20, 2005.
Japanese Office Action dated Jan. 4, 2011, issued in corresponding Japanese Patent Application No. 2007-539783. (w/partial English translation).
Abe Tomoyuki
Koide Masateru
Fujitsu Limited
Patel Ishwarbhai B
Westerman Hattori Daniels & Adrian LLP
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