Multilayer interconnection circuit board

Details Multilayer interconnection circuit board Multilayer interconnection circuit board

1990-04-05

1991-07-23

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174266, 21912165, 21912166, H05K 100, H05K 300

Patent

active

050345699

ABSTRACT:
A multilayer interconnection circuit board includes insulating layers and conductor wiring layers which are alternately laminated. The uppermost conductor wiring layer is electrically connected to an intermediate conductor wiring layer to a predetermined stage by irradiating laser beams in the direction of lamination of layers so that the conductor wiring layer or layers located above the intermediate conductor wiring layer are successively molten by the laser beams. The surface irradiated by the laser beams of the conductor wiring layer at the predetermined stage is treated to reflect laser energy, and the surface of the conductor wiring layer or layers which are molten by the laser beams is treated so as to be susceptive to absorb the laser beams.

REFERENCES:
patent: 4627565 (1986-12-01), Lomerson
patent: 4644130 (1987-02-01), Bachmann
IBM J. Res. Develop, vol. 26, No. 1, Jan. 1982, pp. 37-44, D. P. Seraphim, "A New Set of Printed-Circuit Technologies for The IBM 3081 Processor Unit".

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