Multilayer interconnection board, semiconductor device...

Details Multilayer interconnection board, semiconductor device... Multilayer interconnection board, semiconductor device...

2011-08-30

2011-08-30

Graybill, David E (Department: 2894)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S125000, C438S612000, C438S613000, C438S614000, C438S759000, C438S977000

Reexamination Certificate

active

08008130

ABSTRACT:
In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from being bent.

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