Multilayer interconnection board and connection pin

Details Multilayer interconnection board and connection pin Multilayer interconnection board and connection pin

1998-03-31

1999-11-02

Luebke, Renee S.

Electrical connectors

With selectable circuit, e.g., plug board

Planar circuit overlying a second planar circuit, both...

439 46, 439 48, H01R 2900

Patent

active

059759135

ABSTRACT:
The interconnection board includes a plurality of non-conductive insulation layers and through-holes running through the insulation layers. A plurality of conductive patterns are provided on each insulation layer, electrically insulated from each other, and exposed to the inside of one through-hole at the same axial position of the through-hole. The connection pin has a non-conductive stem and a connection pattern provided on the non-conductive stem. The connection pattern extends in the axial direction of the connection pin and electrically connects two conductive patterns provided on different insulation layers at the same circumferential position in the through-hole, by bringing the conductive patterns into contact at positions which are axially different and circumferentially the same.

REFERENCES:
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patent: 5613858 (1997-03-01), Estes et al.
patent: 5790651 (1998-08-01), Suzuki et al.
"Automated MDF System for Switching System", Akira Fukuoka et al., Fujitsu Scientific & Technical Journal, vol. 28 No. 3 (1992); pp. 422-438.

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