Multilayer interconnection board

Details Multilayer interconnection board Multilayer interconnection board

2008-07-01

2008-07-01

Jones, Stephen E (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Connectors and interconnections

C333S033000, C333S034000

Reexamination Certificate

active

07394337

ABSTRACT:
A multilayer interconnection board (10) comprises a dielectric substrate (11), a through-hole (15), a signal line (12) having a large width section (12A) and a small width section (12B) connected with the through-hole (15), and a ground layer (13, 14). A length L (mm) of the small width section (12B) meets the formula of 0<L≦(3×1010)/(F×√ε), wherein, ε denotes the dielectric constant of the dielectric substrate (11) and F (Hz) denotes the frequency of a signal transmitted through the signal line (12). The ratio (W2/W1) of a line width W2of the small width section (12B) relative to a line width W1of the large width section (12A) is determined to be smaller as the length of a stub portion of the through-hole (15) becomes larger.

REFERENCES:
patent: 5194979 (1993-03-01), Koai et al.
patent: 6215377 (2001-04-01), Douriet et al.
patent: 6661316 (2003-12-01), Hreish et al.
patent: 7187249 (2007-03-01), Nicholson et al.
patent: 2001/0054939 (2001-12-01), Zhu et al.
patent: 2001-44716 (2001-02-01), None
patent: 2004-14800 (2004-01-01), None

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