Multilayer interconnect circuitry using photoimageable dielectri

Details Multilayer interconnect circuitry using photoimageable dielectri Multilayer interconnect circuitry using photoimageable dielectri

1984-06-29

1986-01-28

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 427 97, H01K 310

Patent

active

045661863

ABSTRACT:
A method of fabricating multilayer printed circuit boards using polymer thick film technology is disclosed which utilizes photoimageable dielectric material between conductive polymer thick film layers and which is capable of producing extremely small and uniformly-sized vias.

REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 3835531 (1974-09-01), Luttmer
patent: 3922479 (1975-11-01), Older et al.
patent: 3934335 (1976-01-01), Nelson
patent: 4283243 (1981-08-01), Andreades et al.
patent: 4305204 (1981-12-01), Toggart et al.
patent: 4360570 (1982-11-01), Andreades et al.
patent: 4469777 (1984-09-01), O'Neil
IBM Tech. Discl. Bull. vol. 11, No. 8, Jan. 1969, p. 962, by Hermann.

Affiliated with

Also associated with

Rating

Multilayer interconnect circuitry using photoimageable dielectri does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer interconnect circuitry using photoimageable dielectri, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer interconnect circuitry using photoimageable dielectri will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1299119