Multilayer IC semiconductor package

Details Multilayer IC semiconductor package Multilayer IC semiconductor package

1992-05-12

1994-04-19

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

H05K 100

Patent

active

053047435

ABSTRACT:
An improved multilayer integrated circuit package. The package, which has a plurality of layers of conducting leads, has metal vias which connects leads in a first layer connected to leads in a second layer. The improvement comprises having at least one of the vias with a cross-section such that the via is much larger in a first direction than in a second direction generally perpendicular to said first direction.

REFERENCES:
patent: 4281361 (1981-07-01), Patz et al.
patent: 4694121 (1987-09-01), Ota
patent: 4996391 (1991-02-01), Schmidt

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