Multilayer hybrid integrated circuit

Details Multilayer hybrid integrated circuit Multilayer hybrid integrated circuit

1984-04-06

1985-11-19

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Imaged product

Nonsilver image

430280, 430286, 430920, 428901, 361412, 174 685, G03C 300, H05K 100

Patent

active

045542295

ABSTRACT:
A multilayer circuit device comprises a substrate having a plurality of metallized patterns thereon said patterns being separated by a photodefined polymeric dielectric film formed from a polymeric photodefinable triazine base mixture including a photosensitive acrylate moiety. The various circuit patterns are interconnected by means of microvias through the polymeric film or film layers.

REFERENCES:
patent: 3397204 (1968-08-01), Gaertner
patent: 3900594 (1975-08-01), Guthrie et al.
patent: 4054483 (1977-10-01), Peiffer
patent: 4060656 (1977-11-01), Naka et al.
patent: 4320189 (1982-03-01), Taguchi et al.
patent: 4329384 (1982-05-01), Vesley et al.
patent: 4357219 (1982-11-01), Sattler
patent: 4456712 (1984-06-01), Christie et al.

Affiliated with

Also associated with

Rating

Multilayer hybrid integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer hybrid integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer hybrid integrated circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-83666