Multilayer heat sealant structures, packages and methods of...

Details Multilayer heat sealant structures, packages and methods of... Multilayer heat sealant structures, packages and methods of...

2007-10-12

2011-11-01

Miggins, Michael C (Department: 1782)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S343000, C428S346000, C428S347000, C428S354000, C428S515000, C428S516000, C428S523000

Reexamination Certificate

active

08048521

ABSTRACT:
The embodiments of the present invention relate to multilayer thermoplastic structures having improved sealability and tearability. More specifically, the present invention relates to a multilayer heat sealant structure having at least three layers that may be coextrusion coated or otherwise laminated to a substrate, such as metallized polymeric material, foil, or other substrates.

REFERENCES:
patent: 5322720 (1994-06-01), McMurtrie
patent: 5885707 (1999-03-01), Kaschel et al.
patent: 5948513 (1999-09-01), Turnbull et al.
patent: 6013353 (2000-01-01), Touhsaent
patent: 6248442 (2001-06-01), Kong et al.
patent: 6265055 (2001-07-01), Simpson et al.
patent: 6299968 (2001-10-01), Karaoglu et al.
patent: 6299985 (2001-10-01), Zhang et al.
patent: 6844078 (2005-01-01), Su et al.
patent: 7279206 (2007-10-01), Schell et al.
patent: 2002/0071922 (2002-06-01), Bailey
patent: 2002/0168512 (2002-11-01), Eggers et al.
patent: 2004/0166261 (2004-08-01), Pocket et al.
patent: 2008/0057239 (2008-03-01), Schaefer et al.
patent: 2511768 (2004-06-01), None
patent: 20112691 (2008-12-01), None
patent: 0572034 (1993-12-01), None
patent: 1283108 (2003-02-01), None
patent: 0145934 (2001-06-01), None
European Supplementary Search Report for corresponding European Application 04784327 dated Feb. 10, 2011.
Canadian Office Action for corresponding Canadian Application 2,539,389 dated Nov. 23, 2010.

Affiliated with

Also associated with

Rating

Multilayer heat sealant structures, packages and methods of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer heat sealant structures, packages and methods of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer heat sealant structures, packages and methods of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4286742