Multilayer film with stack of nanometer-scale thicknesses

Details Multilayer film with stack of nanometer-scale thicknesses Multilayer film with stack of nanometer-scale thicknesses

2008-04-16

2010-12-07

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Including dielectric isolation means

C257S211000, C438S128000, C438S598000, C438S623000, C977S932000

Reexamination Certificate

active

07847368

ABSTRACT:
This disclosure describes system(s) and/or method(s) enabling contacts for individual nanometer-scale-thickness layers of a multilayer film.

REFERENCES:
patent: 2744970 (1956-05-01), Shockley
patent: 2939057 (1960-05-01), Teszner
patent: 3964296 (1976-06-01), Matzuk
patent: 4633284 (1986-12-01), Hansell et al.
patent: 5008616 (1991-04-01), Lauks et al.
patent: 5118801 (1992-06-01), Lizardi et al.
patent: 5132278 (1992-07-01), Stevens et al.
patent: 5202290 (1993-04-01), Moskovits
patent: 5237523 (1993-08-01), Bonne et al.
patent: 5330612 (1994-07-01), Watanabe
patent: 5376755 (1994-12-01), Negm et al.
patent: 5418558 (1995-05-01), Hock et al.
patent: 5493167 (1996-02-01), Mikol et al.
patent: 5591896 (1997-01-01), Lin
patent: 5622825 (1997-04-01), Law et al.
patent: 5747180 (1998-05-01), Miller et al.
patent: 5767521 (1998-06-01), Takeno et al.
patent: 5772905 (1998-06-01), Chou
patent: 5780710 (1998-07-01), Murase et al.
patent: 5801124 (1998-09-01), Gamble et al.
patent: 5837454 (1998-11-01), Cozzette et al.
patent: 5837466 (1998-11-01), Lane et al.
patent: 5843653 (1998-12-01), Gold et al.
patent: 5869244 (1999-02-01), Martin et al.
patent: 5918110 (1999-06-01), Abraham-Fuchs et al.
patent: 5972710 (1999-10-01), Weigl et al.
patent: 5997958 (1999-12-01), Sato et al.
patent: 6034389 (2000-03-01), Burns, Jr. et al.
patent: 6085413 (2000-07-01), Klassen et al.
patent: 6120844 (2000-09-01), Chen et al.
patent: 6150097 (2000-11-01), Tyagi et al.
patent: 6150106 (2000-11-01), Martin et al.
patent: 6214631 (2001-04-01), Burrows et al.
patent: 6231744 (2001-05-01), Ying et al.
patent: 6238085 (2001-05-01), Higashi et al.
patent: 6256767 (2001-07-01), Kuekes et al.
patent: 6284979 (2001-09-01), Malozemoff et al.
patent: 6294450 (2001-09-01), Chen et al.
patent: 6331680 (2001-12-01), Klassen et al.
patent: 6355436 (2002-03-01), Martin et al.
patent: 6359288 (2002-03-01), Ying et al.
patent: 6360582 (2002-03-01), Chelvayohan et al.
patent: 6365059 (2002-04-01), Pechenik
patent: 6407443 (2002-06-01), Chen et al.
patent: 6438501 (2002-08-01), Szecsody et al.
patent: 6463124 (2002-10-01), Weisman et al.
patent: 6482639 (2002-11-01), Snow et al.
patent: 6521109 (2003-02-01), Bartic et al.
patent: 6562577 (2003-05-01), Martin et al.
patent: 6643491 (2003-11-01), Kinouchi et al.
patent: 6656275 (2003-12-01), Iwamoto
patent: 6680377 (2004-01-01), Stanton et al.
patent: 6694800 (2004-02-01), Weckstrom et al.
patent: 6747180 (2004-06-01), Ostgard et al.
patent: 7304412 (2007-12-01), Philliber
patent: 7434512 (2008-10-01), Bietsch et al.
patent: 2001/0036721 (2001-11-01), Dallner et al.
patent: 2001/0046674 (2001-11-01), Ellington
patent: 2002/0012937 (2002-01-01), Tender
patent: 2002/0061536 (2002-05-01), Martin
patent: 2002/0117659 (2002-08-01), Lieber et al.
patent: 2002/0130353 (2002-09-01), Lieber et al.
patent: 2002/0175408 (2002-11-01), Majumdar et al.
patent: 2003/0089899 (2003-05-01), Lieber et al.
patent: 2003/0121791 (2003-07-01), Cohen
patent: 2003/0132461 (2003-07-01), Roesner et al.
patent: 2003/0148562 (2003-08-01), Luyken et al.
patent: 2003/0162190 (2003-08-01), Gorenstein
patent: 2003/0170650 (2003-09-01), Karube et al.
patent: 2003/0183008 (2003-10-01), Bang et al.
patent: 2003/0186522 (2003-10-01), Duan et al.
patent: 2003/0189202 (2003-10-01), Li et al.
patent: 2003/0219801 (2003-11-01), Lipshutz
patent: 2003/0224435 (2003-12-01), Seiwert
patent: 2004/0005723 (2004-01-01), Empedocles et al.
patent: 2004/0005923 (2004-01-01), Allard
patent: 2004/0007740 (2004-01-01), Abstreiter et al.
patent: 2004/0009510 (2004-01-01), Seiwert et al.
patent: 2004/0028936 (2004-02-01), Kogiso et al.
patent: 2004/0031975 (2004-02-01), Kern et al.
patent: 2004/0043527 (2004-03-01), Bradley et al.
patent: 2004/0061234 (2004-04-01), Shah et al.
patent: 2004/0134772 (2004-07-01), Cohen et al.
“Ultrahigh-Density Nanowire Lattices and Circuits” California Nanosystems Institute University of California Sciencexpress Report Sciencexpress/www sciencexpress org/13March2003/10 1126/science 1081940 pp. 1-4.
“Sublighographic nanofabrication technology for nanocatalysts and DNA Chips”;J. Vac. Sci. Technol. B21 (6) Nov./Dec. 2003;pp. 2951-2955.
“Percolation-dominated conductivity in a conjugated-polymer-carbon composite” Rapid communications Physical Review B vol. 58 No. 12 Sep. 15, 1998 The American Physical Society pp. RR7492-R7495.
“A polymer gate FET sensor array for detecting organic vapours” Sensors and Actuators B 77 Elsevier Science 2001 pp. 155-162.

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