Multilayer external connection structure having third layer...

Liquid crystal cells – elements and systems – Particular structure – Having significant detail of cell structure only

Reexamination Certificate

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Details

C349S147000, C349S148000, C349S149000, C349S113000, C349S114000

Reexamination Certificate

active

07098985

ABSTRACT:
The invention provides highly reliable wiring and connection terminals of an electro-optic device used as a transfiective liquid crystal device or the like. Since sidewalls and a part of an upper surface of a data line are covered with a reflection film, a central layer is not etched by an etchant when the reflection film is formed by patterning. In addition, since a transparent conductive film is connected to an upper layer of the data line via a contact hole, the resistance of a connection terminal can be decreased, and superior conduction can be obtained.

REFERENCES:
patent: 6444484 (2002-09-01), Ahn
patent: 6466280 (2002-10-01), Park et al.
patent: 6529251 (2003-03-01), Hibino et al.
patent: 6809785 (2004-10-01), Fujino
patent: 2001/0009222 (2001-07-01), Mizouchi et al.
patent: 2002/0045351 (2002-04-01), Jo
patent: 2004/0080688 (2004-04-01), Ishida
patent: A-6-289414 (1994-10-01), None
patent: A-10-268345 (1998-10-01), None
patent: A-10-335303 (1998-12-01), None
patent: A 2000-241832 (2000-09-01), None
patent: A-2000-243834 (2000-09-01), None
patent: A 2001-188240 (2001-07-01), None
patent: A 2000-0062586 (2000-10-01), None

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