Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2006-09-12
2006-09-12
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S758000
Reexamination Certificate
active
07105911
ABSTRACT:
A multilayer electronic substrate is manufactured by employed: a first conductor layer arranged on an insulating substrate; an insulator arranged on the first conductor layer; a resistor arranged on the insulator; and second conductor layers for sandwiching the resistor to be connected to this resistor. In this multilayer electronic substrate, the resistor is trimmed so as to adjust an electric characteristic of a circuit, and a portion of the first conductor layer, which corresponds to a trimming portion of the resistor, is constituted by a first insulating region.
REFERENCES:
patent: 3786557 (1974-01-01), Bodway
patent: 4792779 (1988-12-01), Pond et al.
patent: 5557252 (1996-09-01), Ariyoshi
patent: 5757076 (1998-05-01), Kambara
patent: 5790385 (1998-08-01), Tanimura
patent: 6144287 (2000-11-01), Komeda
patent: 6304167 (2001-10-01), Nakayama
patent: 6475873 (2002-11-01), Kalnitsky et al.
patent: 6806167 (2004-10-01), Kuriyama
patent: 6859133 (2005-02-01), Nakanishi et al.
patent: 2001/0003053 (2001-06-01), Nagasaka
patent: 2003/0132828 (2003-07-01), Hashimoto et al.
patent: 2004/0183155 (2004-09-01), Seto et al.
patent: 19548563 (1997-06-01), None
patent: 0324407 (1989-07-01), None
patent: 59-31412 (1984-02-01), None
patent: 61-65464 (1986-04-01), None
patent: 3-82194 (1991-04-01), None
patent: 3-254197 (1991-11-01), None
patent: 6-77665 (1994-03-01), None
patent: 2001-291603 (2001-10-01), None
patent: 2002-237402 (2002-08-01), None
Corresponding European Search Report dated Feb. 8, 2006.
Japanese Office Action dated Mar. 8, 2006 with English translation.
English translation of Claim 1 in German publication No. DE 19548563.
Ishizaki Koki
Shirato Takeshi
Clark S. V.
Crowell & Moring LLP
LandOfFree
Multilayer electronic substrate, and the method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer electronic substrate, and the method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer electronic substrate, and the method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3566081