Multilayer electronic structure and its preparation

Details Multilayer electronic structure and its preparation Multilayer electronic structure and its preparation

1995-09-13

1998-12-15

Hess, Bruce H.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428325, 428327, 428337, 428458, 4284735, 428901, B32B 300, B32B 1800, B32B 1508

Patent

active

058493964

ABSTRACT:
An electronic structure is formed of alternating layers of a metal and a cured ceramic-polymer mixture. The ceramic-polymer mixture is prepared by mixing small ceramic particles into a flowable, curable polymer. The mixture is spread over a first metallic layer and, optionally, B-stage cured. Additional metallic layers and ceramic-polymer layers are added in alternating fashion. Metallic interconnects may be provided through overlying ceramic-polymer layers to a particular metallic layer. The resulting structure is heated to a moderate temperature to cure the polymer.

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