Communications: radio wave antennas – Antennas – Microstrip
Reexamination Certificate
2005-11-23
2010-11-16
Le, HoangAnh T (Department: 2821)
Communications: radio wave antennas
Antennas
Microstrip
C029S600000
Reexamination Certificate
active
07834808
ABSTRACT:
Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.
REFERENCES:
patent: 5554995 (1996-09-01), Jun
patent: 6133878 (2000-10-01), Lee
patent: 6677899 (2004-01-01), Lee et al.
patent: 7102571 (2006-09-01), McCarrick
patent: 2002/0014992 (2002-02-01), Sun et al.
patent: 2002/0089456 (2002-07-01), Hamada
patent: 2003/0189516 (2003-10-01), Olson
patent: 2003/0201937 (2003-10-01), Lee
patent: 2004/0196190 (2004-10-01), Mendolia et al.
patent: 2004/0201526 (2004-10-01), Knowles et al.
patent: 2005/0099358 (2005-05-01), McCarrick
International Search Report mailed Jul. 17, 2008 in related application No. PCT/US05/42749.
Bairavasubramanian Ramanan
DeJean Gerald
Kingsley Nickolas D.
Li RongLin
Papapolymerou Ioannis
Georgia Tech Research Corporation
Le HoangAnh T
Thomas Kayden Horstemeyer & Risley LLP
LandOfFree
Multilayer electronic component systems and methods of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer electronic component systems and methods of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer electronic component systems and methods of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4168751