Multilayer electronic component and method of manufacturing the

Details Multilayer electronic component and method of manufacturing the Multilayer electronic component and method of manufacturing the

1995-07-20

1997-02-04

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174264, 174262, 361767, 257698, 257774, 29849, 29852, H05K 114

Patent

active

056001010

ABSTRACT:
A multilayer electronic component has a substrate having a major surface with an area which can be utilized for mounting another electronic component thereon, and external electrodes arranged with a small pitch. According to a method of manufacturing multilayer electronic components, the external electrodes can be easily formed, and the characteristics of respective multilayer electronic components in the parent laminate can be measured during manufacture.
The parent laminate is formed by stacking a plurality of insulating sheets provided with via holes each having a conductor and internal circuits connected to the conductors. V-shaped slits are formed in one of the major surfaces of the parent laminate to divide the via holes and the conductors respectively filled in the via holes and expose the conductors within the slits. The exposed conductors respectively serve as the external electrodes of each of the multilayer electronic components obtained by cutting the parent laminate.

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