Multilayer electronic component and manufacturing method...

Details Multilayer electronic component and manufacturing method... Multilayer electronic component and manufacturing method...

2008-01-29

2008-01-29

Lam, Cathy F. (Department: 1775)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S306100, C361S306300, C361S307000, C361S308100, C361S321100, C361S321200

Reexamination Certificate

active

11090557

ABSTRACT:
A multilayer electronic component is composed of a ceramic body obtained by laminating a plurality of ceramic layers via a conductor layer. The conductor layer is a plated film and extracted to one end face of the ceramic body, thereby contributing to the formation of capacity. A peripheral edge portion of the conductor layer composed of the plated film is thicker than its inner region. This avoids stripping on the peripheral edge portion of the conductor layer and avoids internal defects such as delamination. A dummy conductor layer may be formed at a distance on the end opposite the end face for extraction.

REFERENCES:
patent: 3757177 (1973-09-01), Buehler
patent: 3772748 (1973-11-01), Rutt
patent: 4030004 (1977-06-01), Rutt
patent: 4875136 (1989-10-01), Sano et al.
patent: 6195249 (2001-02-01), Honda et al.
patent: 6278602 (2001-08-01), Haratani et al.
patent: 6331932 (2001-12-01), Kobayashi et al.
patent: 6503291 (2003-01-01), Hosokura et al.
patent: 6563689 (2003-05-01), Yamamoto
patent: 6606238 (2003-08-01), Nakamura et al.
patent: 6927966 (2005-08-01), Miyazaki et al.
patent: 7042706 (2006-05-01), Nagai et al.
patent: 09-190946 (1997-07-01), None
patent: 2002-329634 (2002-11-01), None

Affiliated with

Also associated with

Rating

Multilayer electronic component and manufacturing method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer electronic component and manufacturing method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer electronic component and manufacturing method... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3906234