Multilayer electronic component

Details Multilayer electronic component Multilayer electronic component

1996-01-05

1997-06-03

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

439 45, 439 68, 257686, 361735, 361790, 361803, H02G 308, H01R 2900, H01L 2302, H05K 700

Patent

active

056356706

ABSTRACT:
In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

REFERENCES:
patent: 4511201 (1985-04-01), Baker
patent: 4586972 (1986-05-01), Yokotani
patent: 4730241 (1988-03-01), Takaya
patent: 4790894 (1988-12-01), Homma
patent: 4874721 (1989-10-01), Kimura
patent: 4973799 (1990-11-01), Soma
patent: 5140745 (1992-08-01), McKenzie
patent: 5220483 (1993-06-01), Scott
patent: 5225969 (1993-07-01), Takaya
patent: 5488765 (1996-02-01), Kubota

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