Multilayer electronic component

Details Multilayer electronic component Multilayer electronic component

1995-06-07

1997-06-03

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

439 45, 439 68, 361735, 361790, 361803, 257686, H02G 308, H01L 2302, H01R 2900, H05K 700

Patent

active

056356692

ABSTRACT:
A multilayer electronic component having reduced arrangement pitches for external electrodes is formed by providing via holes in a mother laminate with conductive materials. The mother laminate is obtained by stacking a plurality of insulating sheets with interposition of conductor films in positions that are parted by cutting. The conductive materials define external electrodes for individual multilayer electronic components which are obtained by cutting the mother laminate. A specific step for forming the external electrodes is not required, and characteristics of each multilayer electronic component can be efficiently measured while each multilayer electronic component is still part of the mother laminate.

REFERENCES:
patent: 4511201 (1985-04-01), Baker
patent: 4586972 (1986-05-01), Yokotani
patent: 4730241 (1988-03-01), Takaya
patent: 4790894 (1988-12-01), Homma
patent: 4874721 (1989-10-01), Kimura
patent: 4973799 (1990-11-01), Soma
patent: 5140745 (1992-08-01), McKenzie
patent: 5220483 (1993-06-01), Scott
patent: 5225969 (1993-07-01), Takaya
patent: 5488765 (1996-02-01), Kubota

Affiliated with

Also associated with

Rating

Multilayer electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer electronic component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-392923