Multilayer electronic circuit having a conductive adhesive

Details Multilayer electronic circuit having a conductive adhesive Multilayer electronic circuit having a conductive adhesive

1995-09-27

1997-11-18

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428355EP, 428356, 361751, 174259, B32B 900

Patent

active

056885849

ABSTRACT:
A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

REFERENCES:
patent: 2808352 (1957-10-01), Coleman et al.
patent: 3148310 (1964-09-01), Feldman
patent: 3205299 (1965-09-01), Dickie
patent: 3320658 (1967-05-01), Bolda et al.
patent: 3334040 (1967-08-01), Conrad et al.
patent: 3359145 (1967-12-01), Salyer et al.
patent: 3421961 (1969-01-01), Joyce
patent: 3475213 (1969-10-01), Stow
patent: 3491056 (1970-01-01), Saunders et al.
patent: 3541222 (1970-11-01), Parks et al.
patent: 3680037 (1972-07-01), Nellis et al.
patent: 3774232 (1973-11-01), May
patent: 3795047 (1974-03-01), Adolafia et al.
patent: 3823252 (1974-07-01), Schmid
patent: 3883213 (1975-05-01), Glaister
patent: 3885173 (1975-05-01), Lee
patent: 3904934 (1975-09-01), Martin
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 3982320 (1976-09-01), Buchoff et al.
patent: 4064623 (1977-12-01), Moore
patent: 4065197 (1977-12-01), Kuist et al.
patent: 4109377 (1978-08-01), Blazick et al.
patent: 4113981 (1978-09-01), Fujita
patent: 4249302 (1981-02-01), Crepeau
patent: 4261042 (1981-04-01), Ishiwatari et al.
patent: 4388136 (1983-06-01), Huie
patent: 4457796 (1984-07-01), Needham
patent: 4508990 (1985-04-01), Essinger
patent: 4511757 (1985-04-01), Ors et al.
patent: 4554033 (1985-11-01), Dery et al.
patent: 4581679 (1986-04-01), Smolley
patent: 4606962 (1986-08-01), Reylek
patent: 4610756 (1986-09-01), Strobel
patent: 4628022 (1986-12-01), Ors et al.
patent: 4629681 (1986-12-01), Takada et al.
patent: 4642160 (1987-02-01), Burgess
patent: 4645552 (1987-02-01), Vitriol et al.
patent: 4659872 (1987-04-01), Dery et al.
patent: 4680226 (1987-07-01), Takeda
patent: 4713494 (1987-12-01), Oikawa et al.
patent: 4729809 (1988-03-01), Dery et al.
patent: 4737112 (1988-04-01), Jin
patent: 4744850 (1988-05-01), Imano et al.
patent: 4751126 (1988-06-01), Oodaira
patent: 4771537 (1988-09-01), Pryor et al.
patent: 4778635 (1988-10-01), Hechtman et al.
patent: 4788766 (1988-12-01), Burger et al.
patent: 4800461 (1989-01-01), Dixon
patent: 4814040 (1989-03-01), Ozawa
patent: 4830878 (1989-05-01), Kaneko
patent: 4897508 (1990-01-01), Mahulikar
patent: 4926549 (1990-05-01), Yoshizawa et al.
patent: 5041183 (1991-08-01), Nakamura et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5479703 (1996-01-01), Desai
Adachi, Kohei, "Packaging Technology for Liquid Crystal Displays", Solid State Technology, Jan. 1993, pp. 63-71.
Bolger, "Conductive Adhesives", Handbook of Adhesives, pp. 705-712 (date unknown).
Crea, John J., et al., "Development of a Z-Axis Adhesive Film for Flex Circuit Interconnects and Tab Outer Lead Bonding", Reprint NEPCON West '91 Proceedings, pp. 251-259.
Kruetter, N.P., et al., "Effective Polymer Adhesives for Interconnect", 3M Austin, Texas.
Electronic Packaging and Production, vol. 32, No. 11, Nov. 1992, Massachusetts, U.S., pp. 34-37, J. Stopperan, "The Changing Technology of Rigid Flexible".
Reinke, Roger R., "Interconnection Method of Liquid Crystal Driver LSIs by Tab-on-Glass and Board to Glass Using Anisotropic Conductive Film and Monosotropic Heat Seal Connectors", Elform, Incorporated, 41st Electronic Components and Technology Conference.
Excerpts from Compass Programme LCD materials, Technology/Market Update 5, pp. 5-14, pp. 11-14, and pp. 60-76 (1990).
Various Conductive Materials datasheets, Creative Materials Incorporated (1992-93).
"Pulse Heat Temperature Controller TC 1000" and Pulse Heat Thermal Compression Bonder RSM 4000 Elfrom product sheet.
Ken Gilleo, "A Simplified Version of the Multilayer Circuit Process", Electronic Packaging & Production 29 (1989) Feb., No. 2, Newton, Mass., U.S., pp. 134-137.
Gilleo, "A New Multilayer Circuit Process Based on Anisotropicity", draft, published in Nepcon West proceeds, (Feb. 1991).
Gilleo, "Anisotropic Adhesives: Screen-printed Electronic Assembly" SITE, pp. 20-23 (Apr. 1988).
In re Gilleo, Appeal No. 91-1326 (B.P.A.I. 1991).
Grove, Bruce, InterConnection Technology, Z-Axis Adhesives Film: Innovative in Electronic Interconnection, Dec. 1992.
Hitachi Anisotropic Conductive Film ANISOLM.TM. brochure.
Hitachi Anisotropic Conductive Film Anisolm AC-7073 product specifications (1993).
Nipon Graphite Industries, Ltd. Monosotropic product brochure (1991).
"Shel-zac.TM. Anisotropic Interconnect" product Specification (Dec. 1991).
Sony Oriented Conduction Film Connectors CP1030 Technical Information brochure.
Sumitomo Bakelite Co., Ltd. Anisotropic Conductive Film Sumizac 1003 product brochure (1991).
3M, Scotch.TM. 9703 Conductive Adhesive Transfer Tape product brochure (1991).
"Z-link" Multilayer Technology Product Specification (date unknown).

Affiliated with

Also associated with

Rating

Multilayer electronic circuit having a conductive adhesive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer electronic circuit having a conductive adhesive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer electronic circuit having a conductive adhesive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1564269