Multilayer electrical interconnection device and method of makin

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29842, 29843, 29846, H05K 334

Patent

active

060854138

ABSTRACT:
A multilayer, monolithic electrical interconnection device includes a substrate and a plurality of overlaying, alternating conducting and insulating layers deposited atop the substrate and one another. The layers are deposited by thermal spraying of respective insulating or conducting material through defined apertures in respective spray masks. Interlayer electrical connections are intrinsically formed by direct metallurgical bonding between the conducting material of an overlaying layer and the conducting material of a previously sprayed layer.

REFERENCES:
patent: 3872419 (1975-03-01), Groves et al.
patent: 3918148 (1975-11-01), Magdo et al.
patent: 4104607 (1978-08-01), Jones
patent: 4128291 (1978-12-01), Peterson et al.
patent: 4166880 (1979-09-01), Loferski et al.
patent: 4263341 (1981-04-01), Martyniak
patent: 4311727 (1982-01-01), Lazzari
patent: 4464701 (1984-08-01), Roberts et al.
patent: 4525383 (1985-06-01), Saito
patent: 4532152 (1985-07-01), Elarde
patent: 4685197 (1987-08-01), Tigelaar et al.
patent: 4825535 (1989-05-01), Saito et al.
patent: 4882454 (1989-11-01), Peterson et al.
patent: 5252507 (1993-10-01), Hively et al.
patent: 5264712 (1993-11-01), Murata et al.
patent: 5275975 (1994-01-01), Baudouin et al.
patent: 5364813 (1994-11-01), Koh
patent: 5380564 (1995-01-01), VanKuiken, Jr.
patent: 5391841 (1995-02-01), Quick
patent: 5395797 (1995-03-01), Chen et al.
patent: 5434751 (1995-07-01), Cole, Jr. et al.
patent: 5796038 (1998-08-01), Manteghi
Printed Circuit, McGraw-Hill Encyclopedia of Electronics and Computers, C. Duncan; Richard B. Nichols; pp. 636-645; 1984.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multilayer electrical interconnection device and method of makin does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer electrical interconnection device and method of makin, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer electrical interconnection device and method of makin will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-529782

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.