Multilayer core board and manufacturing method thereof

Details Multilayer core board and manufacturing method thereof Multilayer core board and manufacturing method thereof

2008-05-27

2008-05-27

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S264000

Reexamination Certificate

active

07378602

ABSTRACT:
A multilayer core board10includes tapered first via hole conductors51extending from the outer surface of a first insulating layer24to conductive portions42aof a power source layer42, second via hole conductors52extending from the outer surface of a second insulating layer26to the conductive portions42aof the power source layer42, tapered third via hole conductors53extending form the outer surface of the second insulating layer26to conductive portions40aof a ground layer40, and fourth via hole conductors54extending from the outer surface of a center insulating layer22to the conductive portions40aof the ground layer40. The first via hole conductors51are tapered, and thus the interval distance to the adjacent first via hole conductor51is shorter than straight-shaped first via hole conductors, and thus the pitch of the first via hole conductor51at the positive pole side and the fourth via hole conductor54at the negative pole side can be sufficiently reduced. This point is applicable to the third via hole conductors53.

REFERENCES:
patent: 5403672 (1995-04-01), Urasaki et al.
patent: 6127633 (2000-10-01), Kinoshita
patent: 6548767 (2003-04-01), Lee et al.
patent: 6767616 (2004-07-01), Ooi et al.
patent: 6972382 (2005-12-01), Zollo et al.
patent: 2004-134724 (2004-04-01), None

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