Multilayer conductive wire for semiconductor device and manufact

Details Multilayer conductive wire for semiconductor device and manufact Multilayer conductive wire for semiconductor device and manufact

1992-08-24

1995-08-22

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174268, 257747, 257748, 257750, 257775, H05K 100

Patent

active

054441862

ABSTRACT:
A multilayer conductive wire is formed of a plurality of conductive layers stacked upon each other, and has a slit shaped groove extending in the direction intersecting the direction of stress in at least one conductive layer. With the groove mating with a protrusion in another conductive layer or a protrusion in an insulating film layer, a sliding phenomenon between the layers due to the stress can be restrained, so that a multilayer conductive wire free from destruction due to the sliding phenomenon caused by the stress and without losing conductivity can be provided.

REFERENCES:
patent: 4937641 (1990-06-01), Sunami et al.
patent: 5023699 (1991-06-01), Hara et al.
patent: 5084412 (1992-01-01), Nakasaki
patent: 5103268 (1992-04-01), Yin et al.
Patent Abstracts of Japan, vol. 11, No. 227 (E-526), Jul. 23, 1987 (JP62045150).
Patent Abstracts of Japan, vol. 15, No. 375 (E-1114), Sep. 20, 1991 (JP3149829).
Patent Abstracts of Japan, vol. 15, No. 375 (E-1114), Sep. 20, 1991 (JP3149828).

Affiliated with

Also associated with

Rating

Multilayer conductive wire for semiconductor device and manufact does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer conductive wire for semiconductor device and manufact, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer conductive wire for semiconductor device and manufact will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2142791