Multilayer coil component

Details Multilayer coil component Multilayer coil component

2008-05-27

2008-05-27

Nguyen, Tuyen T. (Department: 2832)

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

Reexamination Certificate

active

11844483

ABSTRACT:
A multilayer coil component is formed such that ceramic green sheets having coil conductors and via hole conductors are laminated. The multilayer coil component includes therein a spiral coil in which the coil conductors are connected in series through the via hole conductors. In plan view in a lamination direction, the via hole conductors are located in positions spaced toward the outer side of the spiral coil, the positions being located near end surfaces in a long side direction of a multilayer body.

REFERENCES:
patent: 6008151 (1999-12-01), Sasaki et al.
patent: 6498553 (2002-12-01), Tanaka et al.
patent: 06053044 (1994-02-01), None
patent: 08-138940 (1996-05-01), None
patent: 2000-138120 (2000-05-01), None
patent: 3039538 (2000-05-01), None
patent: 2001060519 (2001-03-01), None
patent: 2001093735 (2001-04-01), None
patent: 2001-176725 (2001-06-01), None
patent: 2001-210522 (2001-08-01), None
patent: 2002-134322 (2002-05-01), None
Official Communication for PCT Application No. PCT/JP2006/317426; mailed Dec. 5, 2006.

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