Multilayer coil and manufacturing method for same

Details Multilayer coil and manufacturing method for same Multilayer coil and manufacturing method for same

1998-05-22

2000-09-05

Kozma, Thomas J.

Inductor devices

Winding with terminals, taps, or coil conductor end...

336200, 336225, 336232, H01F 2729, H01F 2730

Patent

active

061149365

ABSTRACT:
A multilayer coil has a significantly reduced size but still provides a large inductance and a high Q-value. The multilayer coil includes insulative sheets which are respectively provided with coil conductors and via holes and which are laminated and fired. The coil conductors are electrically connected in series through the via holes so as to form a spiral coil. The via holes are disposed at approximately central portions of the side edge surface at the rear of the multilayer type coil, while the via holes are disposed at approximately central portions of the side edge surface at the front thereof.

REFERENCES:
patent: 4641114 (1987-02-01), Person
patent: 4803453 (1989-02-01), Tomono et al.
patent: 5392019 (1995-02-01), Ohkubo

Affiliated with

Also associated with

Rating

Multilayer coil and manufacturing method for same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer coil and manufacturing method for same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer coil and manufacturing method for same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2216396