Multilayer coating method and apparatus

Details Multilayer coating method and apparatus Multilayer coating method and apparatus

1984-11-02

1986-06-24

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

118723, 118726, 427250, 427295, 427422, B05B 124, C23C 1300

Patent

active

045967199

ABSTRACT:
The adhesion of conductive layers to ceramic substrates in the application of such layers by low-energy techniques is improved by interposing between the high-conductivity metal layer and the substrate a layer of refractory metal which is preferably also applied by low-energy vaporization. The metal layers can be provided in succession by reversing the polarity of electrodes composed of the metals of these layers which strike an arc vaporizing the metal to be deposited. One of the electrodes can be shifted out of position and replaced by a substitute electrode and the process repeated to deposit a further layer of metal from the substitute electrode on the substrate.

REFERENCES:
patent: 2588421 (1952-03-01), Shepard
patent: 3010009 (1961-11-01), Ducati
patent: 3340084 (1967-09-01), Eisenlohr
patent: 3491015 (1970-01-01), Naff
patent: 4197175 (1980-04-01), Moll et al.
Article "Nickel Ferrite Thick Films Deposited by Vacuum-Arc Discharge" by Masahiko Naoe et al., Tokyo Institute of Technology (1979)-in English.

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