Multilayer circuit substrate with circuit repairing function, an

Details Multilayer circuit substrate with circuit repairing function, an Multilayer circuit substrate with circuit repairing function, an

1995-10-25

1999-07-13

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174255, 174261, 361795, 361778, H05K 111, H05K 114

Patent

active

059235390

ABSTRACT:
A multilayer circuit substrate with a circuit repairing function which has a circuit substrate having a circuit pattern and repair pattern on the inner layer via an inter-substrate insulation film and having circuit repairing areas for cutting and bonding the circuit on these patterns, a terminal bonding pad for bonding electronic circuit parts mounted on this substrate, and a conductive via hole for bonding said circuit pattern to the terminal bonding pad, wherein at least the circuit repairing area of the repair pattern and at least the circuit repairing area of said circuit pattern which are set on said inner layer are brought close to each other and positioned on the same plane.

REFERENCES:
patent: 4706165 (1987-11-01), Takenaka et al.
patent: 4974048 (1990-11-01), Chakravorty et al.
patent: 5060116 (1991-10-01), Grobman et al.
The ES/9000 Glass Ceramic Thermal Conduction Module Design for Manufacturability, Hardin, et al. IEEE/CHMT'91 IEMT Symposium, pp 351-355.
Micro Electronics Packaging Hand Book, FIG. 1-28, Nikkey BP Co., Mar. 27, 1991.

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