Multilayer circuit substrate and method for forming same

Details Multilayer circuit substrate and method for forming same Multilayer circuit substrate and method for forming same

1995-02-03

1997-06-10

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 361792, 29846, H06K 102

Patent

active

056378343

ABSTRACT:
A multi-layer circuit substrate (500 ) includes at least two substrate layers (130, 150). The first substrate layer (130) has an insulating material (100) with two opposing surfaces (101, 102), and a hole (105) extending between the two surfaces (101, 102). A conductive pattern (110) is formed on a first surface (101) of the insulating material (100) and completely covers the hole (105). The second substrate layer (150) is attached along the second surface (102) of the insulating material (100), and also includes a conductive pattern (155) on insulating material. A conductive material (140) is disposed within the hole (105) that engages the first and second conductive patterns (110, 155).

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