Multilayer circuit prototyping board

Details Multilayer circuit prototyping board Multilayer circuit prototyping board

1987-02-09

1988-09-20

Gensler, Paul

Wave transmission lines and networks

Long lines

Strip type

361400, H01P 308

Patent

active

047728647

ABSTRACT:
A multilayer circuit prototyping board for prototyping circuits in a three-layer transmission line structure. The multilayer circuit prototyping board includes grooves and mesas on one side thereof, with wires to be run in the grooves for interconnecting electronic components. The electronic components are mounted on the bottom surface of the prototyping boards with leads protruding through holes in a bottom ground plane into the grooved portions. Wires or solder bridges are located within the grooves for interconnecting the leads of the various electronic components. A removable top ground plane is then placed atop the board base for completing the three-layer structure.

REFERENCES:
patent: 2019625 (1935-11-01), O'Brien
patent: 3038105 (1962-06-01), Brownfield
patent: 3076862 (1963-02-01), Luedicke et al.
patent: 3191100 (1965-06-01), Sorvillo
patent: 3470612 (1969-10-01), Helms
patent: 4011575 (1977-03-01), Groves
patent: 4524240 (1985-06-01), Stock et al.
patent: 4600970 (1986-07-01), Bauer
patent: 4641140 (1987-02-01), Heckaman et al.
patent: 4688150 (1987-08-01), Peterson

Affiliated with

Also associated with

Rating

Multilayer circuit prototyping board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer circuit prototyping board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer circuit prototyping board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1750802