Multilayer circuit boards and processes of making the same

Details Multilayer circuit boards and processes of making the same Multilayer circuit boards and processes of making the same

1996-04-23

1999-07-27

Lusignan, Michael

Stock material or miscellaneous articles

Composite

Of epoxy ether

156329, 427 96, 427 98, 428447, 4284735, 428702, 428901, B32B 1508, B32B 2738

Patent

active

059287900

ABSTRACT:
This invention relates to a process for improving the adhesion of copper circuitry to a dielectric layer and a method for forming a multilayer printed circuit board wherein the copper circuitry of the board is covered with a layer of an oxide, hydroxide, or combination thereof of a metal selected from the group consisting of tin, bismuth, lead, indium, gallium, germanium, and alloys of said metals. The process and multilayer circuit boards made thereby, have improved laminate adhesion and strength. Further, partial delamination, known as pink ring, is decreased or avoided by the present process. Further, the multilayer structures have decreased bond strength deterioration when exposed to elevated temperatures.

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EP 97 10 6635, Eureopean Search Report mailed Aug. 21, 1997.

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