Multilayer circuit board with repaired I/O pin and process for r

Details Multilayer circuit board with repaired I/O pin and process for r Multilayer circuit board with repaired I/O pin and process for r

1992-10-09

1994-12-13

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174259, 174261, 361785, 439 75, 439 82, A05K 100

Patent

active

053731107

ABSTRACT:
When an external connection I/O pin which is formed on a multilayer ceramic circuit board is broken off together with a part of a ceramic substrate, an electrically conductive adhesive is filled in the area where the I/O pin broke and was removed, and together with standing a new pin in this place and connecting it electrically, the new pin is bridged and secured to the surrounding I/O pins using a fixation plate. In so doing, it is possible to restore the broken I/O pin to have the same electrical and mechanical characteristics as before.

REFERENCES:
patent: 5049434 (1991-09-01), Wasulko
patent: 5173842 (1992-12-01), Depew
patent: 5191224 (1993-03-01), Tazunoki et al.
patent: 5241454 (1993-08-01), Ameen et al.
European Search Report for Application No. EP 92 11 7417.
Patent Abstracts of Japan, vol. 015, No. 185 (E-1066) 13 May 1991 & JP-A-30 46 780 (Fujitsu Ltd) 28 Feb. 1991.
Patent Abstracts of Japan, vol. 015, No. 486 (E-1143) 10 Dec. 1991 & JP-A-32 11 760 (Hitachi Ltd) 17 Sep. 1991.
Patent Abstracts of Japan, vol. 014, No. 225 (E-0927) 14 May 1990 & J-A-20 58 257 (NGK Spark Plug Co Ltd) 27 Feb. 1990.
Patent Abstracts of Japan, vol. 007, No. 218 (E-200) 28 Sep. 1983 & JP-A-58 110 064 (Nippon Denki KK) 30 Jun. 1983.
IBM Technical Disclosure Bulletin, vol. 25, No. 4, Sep. 1982, New York US, p. 1800, Bosley et al., "Pin Attachment To A Substrate".

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