Multilayer circuit board with fluoropolymer interlayers

Details Multilayer circuit board with fluoropolymer interlayers Multilayer circuit board with fluoropolymer interlayers

1987-10-19

1989-04-25

Robinson, Ellis P.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156312, 156333, 156901, 428901, 428209, 428421, 428422, C09J 510

Patent

active

048245119

ABSTRACT:
A multilayer circuit board consisting of multiple circuit layers supported on sheets of PTFE or PTFE containing a fibrous stiffening agent, said circuit-bearing sheets being joined in fixed relative positions by means of separating layers of a adhesive unsintered tetrafluoroethylene resin.

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Abstract of Japanese Publication 60-257,593, write-up by A. L. Knight, dated Jan. 27, 1986.
Japanese Publication-Patent Appln. 60-257593, dated 12-19-85, titled Multilayer Printed Circuit Board.
Abstracts of Japanese Applications: J60257,593; J60257,594; J60257,595; J60257,596; J60257,597; J60257,592; J60258,232.

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