Multilayer circuit board with embedded components and method...

Details Multilayer circuit board with embedded components and method... Multilayer circuit board with embedded components and method...

2007-10-23

2007-10-23

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S765000, C361S784000, C174S260000

Reexamination Certificate

active

11089065

ABSTRACT:
A multilayer substrate assembly (80) includes at least one embedded component (52) within a plurality of stacked pre-processed substrates. Each pre-processed substrate can have a core dielectric (14), patterned conductive surfaces (12and16) on opposing sides of the core dielectric, and at least one hole (18) in each of at least two adjacently stacked pre-processed substrates such that at least two holes are substantially aligned on top of each other forming a single hole (19). The assembly further includes a processed adhesive layer (48) between top and bottom surfaces of respective pre-processed substrates. The embedded component is placed in the single hole and forms a gap (67&66) between the embedded component and a peripheral wall of the single hole. When the assembly is biased, the processed adhesive layer fills the gap to form the assembly having the embedded component cross-secting the plurality of pre-processed substrates.

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Neasia Online, “Table 1”, http:/
easia.nikkeibp.com
ea/200305/manu—244638.html.
Neasia Online, “Figure 4”, http:/
easia.nikkeibp.com
ea/200305/manu—244638.html.

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