Multilayer circuit board, process of manufacturing same,...

Details Multilayer circuit board, process of manufacturing same,... Multilayer circuit board, process of manufacturing same,...

2006-08-22

2006-08-22

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S262000

Reexamination Certificate

active

07095623

ABSTRACT:
A multilayer circuit board having a high level of reliability in terms of electric connection against temperature changes caused by the actual operation of electronic equipment, a manufacturing process, a substrate for multilayer circuitry, and an electronic apparatus. The multilayer circuit board comprises a laminate of at least one insulating layer and at least one wiring layer, wherein the wiring layer is formed by a composite member comprising a first metal layer and a second metal layer formed on one or both sides of the first metal layer, the first metal layer having a smaller coefficient of thermal expansion than the second metal layer, the second metal layer having a higher electric conductivity than the first metal layer, wherein the insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer, the circuit board further comprising a layer-to-layer interconnection portion on the surface of the insulating layer and in the blind via-hole, wherein the layer-to-layer interconnection portion in the blind via-hole is formed in such a manner as to be in contact with the surface of the second metal layer.

REFERENCES:
patent: 5629564 (1997-05-01), Nye et al.
patent: 6248958 (2001-06-01), McClure et al.
patent: 6518509 (2003-02-01), Galasco et al.
patent: 05327227 (1993-12-01), None
patent: 6-85414 (1994-03-01), None
patent: 09162550 (1997-06-01), None
patent: 11274720 (1999-10-01), None
patent: 11-354684 (1999-12-01), None
patent: 2001-189536 (2001-07-01), None

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