Multilayer circuit board for high frequency signals

Details Multilayer circuit board for high frequency signals Multilayer circuit board for high frequency signals

2005-10-11

2005-10-11

Nasri, Javaid H. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

06953349

ABSTRACT:
A multilayer circuit board for high-frequency signals includes: a multilayer wiring board unit including, at least one wiring layer, one or more ground layers configured by a conductive material, insulating layers between the layers, and a first external electrode electrically connected to a transmission line on an episurface; and a connector unit including a second external electrode electrically connected to the first external electrode, and a fitting portion for holding on the multilayer wiring board unit an external circuit board or an external connector. The distance d between the first external electrode (7) and the ground layer perpendicularly below and most closely disposed to the first external electrode is determined within the range dl≦d≦duwith respect to the values dland dudefined based on tolerance of the impedance ΔZ.

REFERENCES:
patent: 6341966 (2002-01-01), Takada et al.
patent: 6866544 (2005-03-01), Casey et al.
patent: 11-054943 (1999-02-01), None
patent: 2000-208887 (2000-07-01), None
patent: 2001-143786 (2001-05-01), None

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