Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1985-06-10
1990-04-10
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 97, 427 98, 29831, 29852, 156901, 156150, 156280, 156643, 156902, 430311, 430312, 430313, 430314, 430316, 430317, 430318, B05D 512, H05K 306, H05K 342, H05K 346
Patent
active
049159836
ABSTRACT:
A process for making additive multilayer circuit boards uses separately designed and fabricated composite structures each consisting of a patterned conductive metal foil supported by a photo-processible insulating film. The composite is bonded foil pattern side down to the substrate or pre-existing multilayer structure and selected areas of the insulating film are removed down to underlying metal sites for electroless plating. All of the apertures in the insulating film are then electrolessly plated full of metal flush to the upper surface. Additional patterned composites are applied and plated up as desired to create blind vias and new conductor patterns layer by layer. In an alternate process a foil clad composite is bonded to an existing substrate foil side up. The insulating layer is selectively etched through windows photoetched in the foil layer. The voids in the insulator layer expose copper sites on the underlying composite. The voids are plated full of metal to form vias and the foil layer is photoetched to make a conductor pattern. The process is repeated to make a multilayer PWB.
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Grandmont Paul E.
Lake Harold
Beck Shrive
Dang Vi Duong
The Foxboro Company
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