Multilayer circuit board and semiconductor device using the...

Details Multilayer circuit board and semiconductor device using the... Multilayer circuit board and semiconductor device using the...

2005-05-10

2005-05-10

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S793000, C257S707000

Reexamination Certificate

active

06891732

ABSTRACT:
A multilayer circuit board for mounting a semiconductor element thereon, comprising a core substrate of a metal material and a plurality of wiring layers stacked on either side of the core substrate, each of the stacked wiring layers being isolated from an adjacent wiring layer by an insulating layer interposed therebetween, the multilayer circuit board having an area at which a heat spreader for dissipating heat generated from the semiconductor element mounted on the circuit board is to be joined to the multilayer circuit board, wherein the multilayer circuit board allows the heat spreader to be joined to the core substrate without the insulating layers being interposed therebetween. A semiconductor device using the multilayer circuit board is also disclosed.

REFERENCES:
patent: 4963697 (1990-10-01), Peterson et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5616888 (1997-04-01), McLaughlin et al.
patent: 5644327 (1997-07-01), Onyskevych et al.
patent: 6323439 (2001-11-01), Kambe et al.

Affiliated with

Also associated with

Rating

Multilayer circuit board and semiconductor device using the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer circuit board and semiconductor device using the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer circuit board and semiconductor device using the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3433855