Multilayer circuit board and process of production thereof

Details Multilayer circuit board and process of production thereof Multilayer circuit board and process of production thereof

1996-08-09

1998-04-28

Thibodeau, Paul J.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174263, 428209, 428458, 428901, H05K 100, B32B 300, B32B 1508

Patent

active

057447586

ABSTRACT:
A multilayer circuit board includes a plurality of substrates. Each of the substrates includes a thermosetting resin film having respective surfaces, a metal layer formed on the one of the surfaces and a thermoplastic polyimide film formed on the other surface. Each of the substrates has at least one via hole, which is filled with thermoplastic polyimide resin containing electrically conductive material to form an electrically conductive via. The metal layer is defined as a predetermined circuit pattern electrically connected to the via. The plurality of substrates are laminated in such a manner that the substrate is adhered to an adjacent one by means of the thermoplastic polyimide film.

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