Multilayer circuit board and method of producing the same

Details Multilayer circuit board and method of producing the same Multilayer circuit board and method of producing the same

1998-01-05

2000-11-28

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29593, 29412, 29413, 29414, 29852, 174255, 174261, H05K 336

Patent

active

061517755

ABSTRACT:
A multilayer circuit board 10 has a laminate 11 formed by stacking together a plurality of insulating sheets with intervening inner circuit elements (not shown). In a first main surface of the laminate 11, there is formed a cavity 12 in which electronic parts such as integrated circuits (not shown) are mounted. Further, for example, in each of the four side surfaces of the laminate 11, there is formed a step portion 13 that is at the boundary between upper and lower halves 111 and 112 of the laminate 11. That is, due to the presence of the step portions 13, the lower half 112 having a height h2 protrudes from the upper half 111 having a height h1. Further, external electrodes (not shown) are formed on the second main surface of the laminate 11 by screen printing. By this structure, there is provided a small-sized multilayer circuit board in which the cavity side walls are not chipped off when the multilayer circuit board is separated from the mother laminate.

REFERENCES:
patent: 5488765 (1996-02-01), Kubota et al.

Affiliated with

Also associated with

Rating

Multilayer circuit board and method of producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayer circuit board and method of producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer circuit board and method of producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1712398