Multilayer circuit board and manufacturing method thereof

Details Multilayer circuit board and manufacturing method thereof Multilayer circuit board and manufacturing method thereof

2008-01-03

2010-12-07

Norris, Jeremy C (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C029S852000

Reexamination Certificate

active

07847197

ABSTRACT:
A multilayer circuit board includes a laminate having a plurality of ceramic layers, and a wiring pattern disposed in the laminate, wherein a ceramic layer includes, as the wiring pattern, a fully penetrating via-hole conductor that vertically passes through the ceramic layers, and a serial partially penetrating via-hole conductor that is electrically connected to the fully penetrating via-hole conductor in the ceramic layers and does not pass completely through the ceramic layers.

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Official communication issued in the International Application No. PCT/JP2006/308084, mailed on Jul. 18, 2006.
Official communication issued in counterpart Chinese Application No. 2006800242127, mailed on May 8, 2009.
Official Communication issued in corresponding Japanese Patent Application No. 2007-524522, mailed on Aug. 10, 2010.

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