Multilayer circuit board and manufacturing method thereof

Details Multilayer circuit board and manufacturing method thereof Multilayer circuit board and manufacturing method thereof

2006-01-25

2010-06-15

Patel, Ishwarbhai B (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000

Reexamination Certificate

active

07737367

ABSTRACT:
Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

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Kiyoshi Takagi, “Build-up Multiplayer Printed Circuit Board Technology,” The Nikkan Kygyo Shimbun. Ltd, Published on Jun. 15, 2001, First Edition, Second printed version, pp. 53-76, together with an English language translation of the same.
English Language Abstract of JP 7-147464.
English Language Abstract of JP 2004-221426.
English language Abstract of JP 2001-144445.
English language Abstract of JP 2002-009441.

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