Multilayer circuit board

Details Multilayer circuit board Multilayer circuit board

1980-04-07

1981-11-10

Van Balen, William J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

156252, 428210, 428901, B32B 310

Patent

active

042998735

ABSTRACT:
A multilayer circuit board obtained by laminating and bonding a plurality of ceramic substrates, each substrate having holes therein and a conductive circuit pattern on at least one surface thereof, and bonding layers between each ceramic substrate, said bonding layers containing an organic or inorganic adhesive and an inorganic filler and having good electrical insulating properties, good thermal conductivity and a larger coefficient of thermal expansion than that of the ceramic substrate shows good thermal conductivity, wiring accuracy and productivity.

REFERENCES:
patent: 3725186 (1973-04-01), Lynch
patent: 3852877 (1974-12-01), Ahn et al.
patent: 4020206 (1977-04-01), Beil
patent: 4137628 (1979-02-01), Suzuki
patent: 4164442 (1979-08-01), Bartelmuss
patent: 4169001 (1979-09-01), Kaiser
IBM Technical Disclosure Bulletin vol. 21, No. 5, 1860-1861, 1862-1863 (1978).

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