Multilayer circuit board

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S748000, C361S760000, C361S793000, C336S199000, C336S200000

Reexamination Certificate

active

11079373

ABSTRACT:
A multilayer circuit board includes: two or more layers of electrical insulative base members; and two or more layers of conductive patterned layers. At least two of the conductive patterned layers include coil patterns that will be a part of a coil, through holes are provided at predetermined positions of the electrical insulative base members, the positions being sandwiched between the coil patterns, so as to enable communication between respective end portions of the coil patterns, and conductive paste charged in the through holes allows electrical connection to be established between the respective end portions. The coil is formed so as to be wound in a direction perpendicular to a thickness direction of the multilayer circuit board. With this configuration, a multilayer circuit board can be provided, which facilitates increasing the winding number of a coil and has excellent flexibility of circuit design.

REFERENCES:
patent: 5373276 (1994-12-01), Suppelsa et al.
patent: 5572180 (1996-11-01), Huang et al.
patent: 6011330 (2000-01-01), Goodman et al.
patent: 2002/0057174 (2002-05-01), Uchikoba et al.
patent: 2005/0174208 (2005-08-01), Sato et al.
patent: 2006/0109071 (2006-05-01), Thongsouk et al.
patent: 2006/0145805 (2006-07-01), Kim et al.
patent: 2007/0001795 (2007-01-01), Brandt et al.
patent: 2007/0085648 (2007-04-01), Lee et al.
patent: 2007/0090912 (2007-04-01), Lee
patent: 2000-223316 (2000-08-01), None
patent: 2001-77538 (2001-03-01), None

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