Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1988-03-23
1992-08-04
Tolin, Gerald P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174110FC, 174117FF, 331 1R, 361414, H05K 102
Patent
active
051361230
ABSTRACT:
A multilayer circuit board is provided having an inner porous fluororesin layer containing electrical circuits, a ground conductor layer located adjacent the fluororesin layer on one side thereof and a power supply conductor layer located adjacent the fluororesin layer on the other side thereof, and a reinforcing, solid plastic dielectric layer adjacent each conductor layer and being external to the inner fluororesin layer. In an alternate embodiment, the multilayer circuit board may have a plurality of inner porous fluororesin layers, at least one fluororesin layer containing electrical circuits, and may have ground conductors and power supply conductors adjacent each fluororesin layer, and reinforcing, solid plastic dielectric layers on the outermost surfaces of the circuit board assembly. The ground and power supply conductor layers extend over the entire surfaces, respectively, of the inner fluororesin layers.
REFERENCES:
patent: 3740678 (1973-06-01), Hill
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 4314002 (1982-02-01), Olzumi et al.
patent: 4382236 (1983-05-01), Suzuki
patent: 4423282 (1983-12-01), Suzuki et al.
patent: 4490690 (1984-12-01), Suzuki
patent: 4560962 (1985-12-01), Barrow
patent: 4639693 (1987-01-01), Suzuki et al.
patent: 4640866 (1987-02-01), Suzuki
patent: 4675789 (1987-06-01), Kuwabara et al.
patent: 4701576 (1987-10-01), Wada et al.
patent: 4707671 (1987-11-01), Suzuki et al.
patent: 4710854 (1987-12-01), Yamada et al.
patent: 4755911 (1988-07-01), Suzuki
patent: 4770922 (1988-09-01), Hatakeyama et al.
Hirose Tetsuya
Kobayashi Satoru
Suzuki Masahiro
Tanaka Satoshi
Junkosha Co. Ltd.
Tolin Gerald P.
Uebler E. Alan
LandOfFree
Multilayer circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-779999