Multilayer circuit and process for manufacturing the same

Details Multilayer circuit and process for manufacturing the same Multilayer circuit and process for manufacturing the same

1982-09-30

1984-03-06

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29569R, 357 71, 427 89, 427125, 174 685, H01L 2946

Patent

active

044345445

ABSTRACT:
A multilayer circuit construction includes a conductive layer formed of an alloy of a noble metal and a small amount of a base metal disposed on a heat resistant insulating substrate. The portion of the substrate not covered with the conductive alloy is covered with an oxide of the base metal constituent of the alloy. The construction may be formed by depositing a base metal layer over the substrate, followed by depositing the noble metal over a part of the base metal layer. By oxidizing at high temperatures, the exposed base metal layer is converted to oxide, while the noble metal and the base metal thereunder diffuse into each other to form the alloy.

REFERENCES:
patent: 3350498 (1967-10-01), Leeds
patent: 3386894 (1968-06-01), Steppat
patent: 3663279 (1972-05-01), Lepselter

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