Multilayer chip capacitor and circuit board device

Details Multilayer chip capacitor and circuit board device Multilayer chip capacitor and circuit board device

2009-12-29

2011-11-08

Ha, Nguyen T (Department: 2835)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S321200, C361S303000, C361S767000, C361S763000

Reexamination Certificate

active

08054607

ABSTRACT:
There are provided a multilayer chip capacitor and a circuit board device. The multilayer chip capacitor includes a capacitor body including a plurality of dielectric layers that are stacked, first and second outer electrodes formed on an outer surface of the capacitor body and having opposite polarity, first and second inner electrodes opposing each other, interleaved with the dielectric layers in the capacitor body, and each including an electrode plate forming capacitance and a lead extending from the electrode plate, the lead of the first inner electrode and the lead of the second electrode being respectively connected to the first and second outer electrodes, and third inner electrodes interposed between the first and second inner electrodes. At least one of the third inner electrodes adjacent to the first inner electrode includes a conductive pattern having the same shape as the lead of the first inner electrode and is connected to the first outer electrode. At least one of the third inner electrodes adjacent to the second inner electrode includes a conductive pattern having the same shape as the lead of the second inner electrode and is connected to the second outer electrode.

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Korean Office Action, with English translation, issued in Korean Patent Application No. 10-2009-0085356, mailed Dec. 23, 2010.

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