Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2008-07-18
2010-10-26
Nguyen, Khanh (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S289000, C156S299000, C156S291000, C051S297000, C451S533000, C451S538000, C451S539000
Reexamination Certificate
active
07820005
ABSTRACT:
A method for making a multilayer chemical mechanical polishing pad comprising: providing a polishing layer, providing a subpad layer, optionally providing additional layers, providing an unset reactive hot melt adhesive, applying the unset reactive hot melt adhesive in a pattern on a surface of at least one of the layers, applying one of the other layers over the pattern of unset reactive hot melt adhesive, pressing the two layers together with the unset reactive hot melt adhesive interposed therebetween, allowing the unset reactive hot melt adhesive to set forming a reactive hot melt adhesive bond between the two layers.
REFERENCES:
patent: 4728552 (1988-03-01), Jensen, Jr.
patent: 5222331 (1993-06-01), Manor et al.
patent: 5257478 (1993-11-01), Hyde et al.
patent: 5507906 (1996-04-01), Woods et al.
patent: 6616519 (2003-09-01), Mansfield
patent: 6699104 (2004-03-01), Baker, III et al.
patent: 6884156 (2005-04-01), Prasad et al.
patent: 7101275 (2006-09-01), Roberts et al.
patent: 7377018 (2008-05-01), Taylor
Copending U.S. Appl. No. 12/175,965, published Jan. 21, 2010.
Corder Carol
Harding Brenda
Jensen Michelle
Nowland John Gifford
Deibert Thomas S.
Nguyen Khanh
Rohm and Haas Electronic Materials CMP Holdings Inc.
Squalls Margaret
LandOfFree
Multilayer chemical mechanical polishing pad manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayer chemical mechanical polishing pad manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayer chemical mechanical polishing pad manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4203608