Multilayer ceramic wiring board

Details Multilayer ceramic wiring board Multilayer ceramic wiring board

1990-09-19

1992-03-03

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, 428220, 428698, 361397, B32B 900

Patent

active

050931865

ABSTRACT:
A multilayer ceramic wiring board including a ceramic board having a plurality of through-holes and formed by laminating three or more green sheets of a ceramic material and burning a laminate of the green sheets, and a plurality of conductors provided in the through-holes. Each of the conductors is formed of a ceramic material and a conductive material in combination. The ceramic board is composed of a pair of upper and lower layer portions each having at least an outermost surface layer and an inner layer portion disposed between the upper and lower portions. The conductors are composed of an outer conductor portion formed in the upper and lower layer portions and an inner conductor portion formed in the inner layer portion. The outer conductor portion has a content ratio of the ceramic material higher than that of the inner conductor portion. Accordingly, the generation of cracks in the outer conductor portion disposed at the upper and lower layer portions of the ceramic board can be prevented, and an electric resistance can be reduced.

REFERENCES:
patent: 4465727 (1984-08-01), Fujita et al.
patent: 4835039 (1989-05-01), Barringer et al.

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