Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1991-12-23
1993-01-05
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 84, 156 89, 156344, 156247, 4273762, 427287, B32B 3100
Patent
active
051767716
ABSTRACT:
A plurality of sheets (12,16,18) of Low-Temperature-Cofired-Ceramic (LTCC) tape or other fusible ceramic tape are laminated together. A pattern (10) is printed on an external surface (12a) of the laminated structure (20) of a material having a thermal shrinkage rate which is different from that of the tape. The pattern (10) may be printed before or after lamination. The structure (20) is then baked to burn organic materials out of the tape. During this step, the pattern (10) and underlying portions (12b,12c) of the upper tape sheet (12) shrink to a different extent than the bulk of the structure (20), and delaminate therefrom to form cavities (26,28) having the same shape as the pattern (10). The structure (20) is then fired to sinter the tape and form a fused multilayer substrate (32). The cavities (26,28) may be filled with an electrically conductive or resistive material (36,38). Conductor traces (76,82;78,84) which are considerably thickner than can be fabricated using conventional thick film technology may be formed by filling cavities (72,74) with conductive material (76,78), and printing more conductive material (82,84) over the material (76,78) in the cavitities (72,74). Alternatively, cavities (94,96) may be filled with an adhesive (98,100) for bonding a component such as a cover lid (104) to a multilayer substrate (92).
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The Use of Low-Temperature, Cofired Ceramic Technology for the Fabrication of High-Density, Hermetic, Multicavity Modules, C. Sabo et al., Journal of the America Ceramic Society, Ceramic Substrates and Packages for Electronic Applications, Advances in Ceramics, vol. 26, 1988, pp. 217-228.
Bravo Pedro L.
Klyachman Roman
De Simone M.
Denson-Low W. K.
Gudmestad Terje
Hughes Aircraft Company
Simmons David A.
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